A silicon wafer has a total of 200 integrated circuits (ICs) at the beginning of its fabrication sequence. A total of 60 operations are used to complete the integrated circuits, each of which inflicts damages on 1.0 percent of the ICs. The damages compound, meaning that an IC that is already damaged has the same probability of being damaged by a subsequent process as a previously undamaged IC. How many defect-free ICs remain at the end of the fabrication sequence?